Nordic applauds TSMC fab launch in Germany and supply chain resilience it offers European semiconductor companies
2024
The new fab will be based in Dresden and give TSMC’s European fabless semiconductor companies, like Nordic, the ability to make chips locally in Europe
Nordic Semiconductor joined industry leaders at the groundbreaking launch of TSMC’s first European semiconductor fab in Dresden, Germany, on August 20.
Strengthening Europe's semiconductor supply chain
While not directly involved in the facility’s development, Nordic recognizes the critical role this new fab will play in strengthening the resilience and localization of Europe's semiconductor supply chain. This marks a significant milestone for the European semiconductor ecosystem, bringing advanced manufacturing closer to fabless European companies like Nordic. It also underscores the strategic importance of a more self-sufficient supply chain in the region.
Partnership and Funding
TSMC is a long-standing fabrication partner of Nordic Semiconductor. The $10 billion fab is being co-funded by the European Commission, German government, and a consortium of European semiconductor companies that will form the new European Semiconductor Manufacturing Company (ESMC).&
Distinguished guests at the fab launch ceremony included president of the European Commission, Ursula von der Leyen, and German Chancellor Olaf Scholz.
Nordic's perspective on the fab launch
I was truly honored and elated to be invited to the groundbreaking launch of TSMC’s first fab in Europe,” says Ole-Fredrik Morken, EVP of Supply Chain at Nordic. “This is truly a milestone for the European semiconductor ecosystem and community. And one that will serve the wireless IoT market with key technologies and help Nordic to further secure and optimize the global supply chain of its chips.
TSMC's vision for Europe
TSMC Chairman & CEO C.C. Wei summarized at the ceremony: Together with our partners, Bosch, Infineon and NXP, we are building our Dresden facility to meet the semiconductor needs of the rapidly growing European automotive and industrial sectors. With this state-of-the-art manufacturing facility, we will bring TSMC's advanced manufacturing capabilities within reach of our European customers and partners, which will stimulate economic development within the region and drive technological advancements across Europe."
Capacity and technological impact
When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology.